Industrial Fanless System 8/9th Gen


Industrial Fanless System 8/9th Gen

Key Features:

  • LGA1151 socket 9th/8th gen Intel® Core™ i7/i5/i3 or Celeron® processor (Coffee Lake)
  • Supports 2 COM, 6 USB, 8-CH DI/DO, HDMI, DisplayPort
  • Two 2.5″ SATA drive bay
  • 2 Key E 2230 for Wi-Fi
  • Front I/O connectivity design
  • Supports flexible I/O window


Technical Specifications

Model Name XPC640-521-FL-DC
CPU Up to 16 10/100/1000BASE-T(X) auto negotiation speed
System Memory  2 x 260-pin DDR4-2400 SO-DIMM, up to 64GB
Chipset Intel® H310
System I/O Outlet 1 x RS-232/422/485

1 x RS-232

2 x 10/100/1000Mbps Ethernet (Intel® i219V-LM, i211-AT)

2 x USB 3.0

4 x USB 2.0

1 x Audio (Line-out)

1 x DisplayPort

1 x HDMI

1 x DC-jack power input

1 x 8-CH DIO (4-in/4-out)

4 x SMA-type antenna connector

1 x Flexible I/O window

Storage 2 x 2.5” SATA HDD drive bay (up 15 mm height)
Expansion Interface 1 x Full-size PCI-Express Mini Card slot (PCIe + SATA + USB

1 x M.2 Key E 2230 (for Wi-Fi)

Watchdog Timer 255 levels, 1 to 255 sec.
System Indicator 1 x Green for system power

1 x Orange LED for HDD active

Power Input 19 VDC, 6.32A (12V, 24V DC can be used by option adapter)
Operating Temperature -10°C to +50°C (14°F to 122°F) (with W.T. SSD/DRAM)
Humidity 10% – 90%, non-condensing
Construction Aluminum extrusion and heavy-duty steel, IP40
Vibration Endurance IEC 60068-2-64 (w/SSD: 3Grms STD, random, 5 – 500 Hz, 1 hr/axis)
Shock Vibration IEC 60068-2-27 (w/SSD: 50G, half sine, 11 ms duration)
Dimensions 195 mm (7.67″) (W) x 210.6 mm (8.27″) (D) x 80 mm (3.14″) (H)
Weight (net/gross) 3 kg (6.61 lb)/3.6 kg (7.94 lb)
Certifications CE, FCC Class A
EOS Support Win 10 IoT, Linux
Mounting Wall mount kit, DIN-rail kit
Model name Description
XPC640-521-FL-DC Fanless embedded system with LGA1151 9th/8th gen Intel® Core™ i7/i5/i3 or Celeron® processor, Intel® H310, HDMI, DisplayPort, 6 USB, 2 COM, M.2 slot, and 19 VDC



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